LY-G850 220V 6800W hot air Align BGA rework station semi-automatic 3zones max 50*45cm big area | Инструменты

LY-G850 220V 6800W hot air Align BGA rework station semi-automatic 3zones max 50*45cm big area | Инструменты

·       Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.

·       PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.

·       Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode[preheating,constant,warming,soldering,reflow soldering,cooling.

·       Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction model weld,remove,mount,manual,realize semi auto and auto function ,meet customer’s requirement

·       High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree

·       Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.

·       Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.

·       High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.

·       Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )

Technology Parameter of LY-G850 BGA Rework Machine

Power

6800W

Up heater power

1200W

Down heater power

1200W

IR heater power

4200W(2400W control)

Power supply

(Single Phase)  AC 220V±10 50Hz

Position way

Optical lens+ Vshape holder+laser positioning

Temperature control

High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃

Material

High sensitive touch screen+temperature control module+PLC+step drive

PCB Size

Max:500*450mm ， Min: 10*10mm

Thermo-couple Ports

4pcs

Chips magnification times

2-30

PCB thickness

0.5-8mm

BGA size

0.8mm-8cm

Min.chips pitch

0.15mm

Mounting BGA weight

1000G

Mounting precision

±0.01mm

Overall dimension

L670*W780*H850mm

Optical alignment lens

Motor drive can move front back right left

Weight of machine

About 150kg